Nguồn gốc:
Trung Quốc/Campuchia
Hàng hiệu:
Suntek
Chứng nhận:
ISO9001, ISO13485, TS16949 and UL E476377
Số mô hình:
F9632-123
băng hình
băng hình
băng hình
Suntek Electronics Co., Ltd - Main facility located in Hunan province, China
BLSuntek Electronics Co., Ltd - New facility located in Kandal province, Cambodia
Certified with ISO9001:2015, ISO13485:2016, IATF 16949:2016 and UL E476377. We deliver high-quality products at competitive prices worldwide.
Our advanced manufacturing capabilities include:
Applications: Industrial control, automotive, telecommunications, medical equipment, consumer electronics.
Core philosophy: "Quality wins Market, Ideas create the Future"
| Item | Capability |
|---|---|
| Min. Finished Board Thickness | 0.05mm |
| Max Board Size | 500mm*1200mm |
| Min Laser Drilled Hole Size | 0.025mm |
| Min Mechanical Drilled Hole Size | 0.1mm |
| Min. Trace Width/Spacing | 0.035mm/0.035mm |
| Min. Annular Ring of Single/Double-side Board | 0.075mm |
| Min. Inner Layer Annular Ring of Multi-layer Board | 0.1mm |
| Min. Outer Layer Annular Ring of Multi-layer Board | 0.1mm |
| Min Coverlay Bridge | 0.1mm |
| Min. Soldermask Opening | 0.15mm |
| Min. Coverlay Opening | 0.35mm*0.35mm |
| Min Single-ended Impedance Tolerance | +/-7% |
| Max Layer Count | 12L |
| Material Type | PI, Kapton |
| Material Brand | Shengyi, Taiflex, Thinflex, ITEQ, Allstar, Panasonic, Dupont, Jiujiang |
| Stiffener Material Type | FR4, PI, PET, Steel, AI, Adhesive Tape, Nylon |
| Coverlay Thickness | 12.5um/25um/50um |
| Surface Finish | ENIG, ENEPIG, OSP, Gold Plating, Gold Plating+ENIG, Gold Plating+OSP, Imm Silver, Imm Tin, Plating Tin |
Gửi yêu cầu của bạn trực tiếp cho chúng tôi
